The BGA uses surface mount technology: it connects to top layer of the PCB only,
allowing circuit traces to be routed underneath, and it provides for High Density
Interconnections (HDI) with its efficient use of board space.
The leads, between the chip inside and the pads across the bottom of the chip, are
shorter, allowing for greater speed with less inductance. Heat, too, is less of
a problem because the BGA is soldered directly to the board, and the heat doesn’t
have to go all the way to the edges of the IC, and down its leads, in order to be dissipated.
Among the uses for Ball Grid Arrays are audio, video, data storage and processing,
communication equipment, medical equipment, radar/sonar, 3D graphics, and imaging.
Contact us at firstname.lastname@example.org for
more information on Ball Grid Array technology.