|
|
|
|
|
|
|
Item
|
Standard
|
Advanced
|
|
|
|
|
|
• Minimum Line/Spacing, Internal
|
3/3
|
3/3
|
|
|
|
|
|
• Minimum Line/Spacing, External
|
4/4
|
3/3
|
|
|
|
|
|
• Minimum Drilled Hole Size
|
8
|
6
|
|
|
|
|
|
• Aspect Ratio (Thickness to Drill)
|
10:1
|
15:1
|
|
|
|
|
|
• Anular Ring (Diameter over Drill)
|
10
|
8
|
|
|
|
|
|
• Anti-pad (Diameter over Drill)
|
20
|
16
|
|
|
|
|
|
• Plated Hole Tolerance
|
±3
|
±2
|
|
|
|
|
|
• Minimum Dielectric Thickness
|
3
|
2
|
|
|
|
|
|
• Maximum PCB Thickness (inches)
|
0.200
|
0.250
|
|
|
|
|
|
• Thickness Tolerance (% of Thickness)
|
±10
|
±7
|
|
|
|
|
|
• Maximum PCB Dimensions (inches)
|
16.0 X 22.0
|
30.0 X 44.0
|
|
|
|
|
|
• Fabricated Dimensions - NC Routing
|
±5 mils
|
±3 mils
|
|
|
|
|
|
• Layer-to-Layer Registration Tolerance
|
±5
|
±3
|
|
|
|
|
|
• Solder Mask Clearance, Per Side
|
2.0 mils
|
1.5 mils
|
|
|
|
|
|
• Blind/Buried Vias (All Types)
|
yes
|
yes
|
|
|
|
|
|
• Via Fill (Conductive, Non-Conductive)
|
no
|
yes
|
|
|
|
|
|
|
|
Inner Layers
|
Standard
|
Advanced
|
|
|
|
|
|
• Minimum Core thickness
|
3 mils
|
2 mils
|
|
|
|
|
|
• Minimum Line width
|
4 mils
|
3 mils (H Oz copper)
|
|
|
|
|
|
• Minimum Spacing (Air gap)
|
4 mils
|
3 mils (H Oz copper)
|
|
|
|
|
|
• Minimum pad size
|
Drill size+10 mils
|
Drill Size+7 mils
|
|
|
|
|
|
• Minimum Anti Pad (planes)
|
Drill Size+20 mils
|
Drill Size+16 mils
|
|
|
|
|
|
|
|
|
|
|
Outer Layers
|
Standard
|
Advanced
|
|
|
|
|
|
• Max. Finished Thickness
|
0.200
|
0.250
|
|
|
|
|
|
• Thickness Tolerance
|
±10%
|
±5%
|
|
|
|
|
|
• Max. Aspect Ratio
|
10:1
|
12:1
|
|
|
|
|
|
• Min. Drill Size
|
10 mils
|
8 mils
|
|
|
|
|
|
• Min. Line width
|
4 mils
|
3 mils
|
|
|
|
|
|
• Min. Spacing (air gap)
|
4 mils
|
3 mils
|
|
|
|
|
|
• Min. Solder mask clearance
|
4 mils
|
3 mils
|
|
|
|
|
|
• Min. solder mask web thickness
(mask between pads)
|
4 mils
|
3.4 mils
|