Capabilities: Technologies

 
Item Standard Advanced
• Minimum Line/Spacing, Internal 3/3 3/3
• Minimum Line/Spacing, External 4/4 3/3
• Minimum Drilled Hole Size 8 6
• Aspect Ratio (Thickness to Drill) 10:1 15:1
• Annular Ring (Diameter over Drill) 10 8
• Anti-pad (Diameter over Drill) 20 16
• Plated Hole Tolerance ±3 ±2
• Minimum Dielectric Thickness 3 2
• Maximum PCB Thickness (inches) 0.200 0.250
• Thickness Tolerance (% of Thickness) ±10 ±7
• Maximum PCB Dimensions (inches) 16.0 X 22.0 30.0 X 44.0
• Fabricated Dimensions - NC Routing ±5 mils ±3 mils
• Layer-to-Layer Registration Tolerance ±5 ±3
• Solder Mask Clearance, Per Side 2.0 mils 1.5 mils
• Blind/Buried Vias (All Types) yes yes
• Via Fill (Conductive, Non-Conductive) no yes
Inner Layers Standard Advanced
• Minimum Core thickness 3 mils 2 mils
• Minimum Line width 4 mils 3 mils (H Oz copper)
• Minimum Spacing (Air gap) 4 mils 3 mils (H Oz copper)
• Minimum pad size Drill size+10 mils Drill Size+7 mils
• Minimum Anti Pad (planes) Drill Size+20 mils Drill Size+16 mils
Outer Layers Standard Advanced
• Max. Finished Thickness 0.200 0.250
• Thickness Tolerance ±10% ±5%
• Max. Aspect Ratio 10:1 12:1
• Min. Drill Size 10 mils 8 mils
• Min. Line width 4 mils 3 mils
• Min. Spacing (air gap) 4 mils 3 mils
• Min. Solder mask clearance 4 mils 3 mils
• Min. solder mask web thickness
(mask between pads)
4 mils 3.4 mils
 
 
 
 
 
 
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