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PCB Updates
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Quick Turn Proto & Production. RoHS Compliance Circuit Boards
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Via in Pad Micro Via Technology, HDI
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0.4mm BGA with 4 mil laser drill via hole & 3/3 Line & Spacing
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Hard Gold 50u", Soft Gold, Imm. Gold, Imm. Silver, OSP, White Tin
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Specialized in Laser Drill Micro Vias & Stack Vias, Blind Buried Vias
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Conductive & Non Conductive, Epoxy Fill, Solder mask Via Plugging
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0.3mm Flip Chip with Stacked Micro Via Technology
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ITAR Registered, UL Listed
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Controlled Impedance, Dieelectric Thickness
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