PCB Updates

Quick Turn Proto & Production. RoHS Compliance Circuit Boards

Via in Pad Micro Via Technology, HDI

0.4mm BGA with 4 mil laser drill via hole & 3/3 Line & Spacing

Hard Gold 50u", Soft Gold, Imm. Gold, Imm. Silver, OSP, White Tin

Specialized in Laser Drill Micro Vias & Stack Vias, Blind Buried Vias

Conductive & Non Conductive, Epoxy Fill, Solder mask Via Plugging

0.3mm Flip Chip with Stacked Micro Via Technology

ITAR Registered, UL Listed

Controlled Impedance, Dieelectric Thickness


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